View HD74HC4051FPEL_4308218.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

HD74HC4051
8-Channel Analog Multiplexer Demultiplexer
REJ03D0648-0200 (Previous ADE-205-535) Rev.2.00 Mar 30, 2006
Description
This device connects together the outputs of 8 switches, thus achieving an 8 Channel Multiplexer. The binary code placed on the A, B, and C select lines determine which one of the eight switches in "on", and connects one of the eight inputs to the common output.
Features
* High Speed Operation * Wide Operating Voltage: VCC = 2 to 6 V * Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) * Ordering Information
Part Name HD74HC4051P HD74HC4051FPEL HD74HC4051RPEL Package Type DILP-16 pin SOP-16 pin (JEITA) SOP-16 pin (JEDEC) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) PRSP0016DG-A (FP-16DNV) P FP RP Package Abbreviation -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) Taping Abbreviation (Quantity)
Note: Please consult the sales office for the above package availability.
Function Table
Control Inputs Inhibit L L L L L L L L H X: Irrelevant C L L L L H H H H X B L L H H L L H H X A L H L H L H L H X ON Switch X0 X1 X2 X3 X4 X5 X6 X7 --
Rev.2.00 Mar 30, 2006 page 1 of 10
HD74HC4051
Pin Arrangement
X4 X6 X X7 X5 Inhibit VEE GND 1 X4 2 3 4 5 6 7 C 8 (Top view) 9 C X6 X X7 X5 Inhibit X2 X1 X0 X3 A B 15 X2 14 X1 13 X0 12 X3 11 A 10 B 16 VCC
Block Diagram
VCC
Inhibit A Control B C Level Converter Binary to 1-of-8 Decoder With inhibit
GND X0 X1 X2 Switch In/Out X3 X4 X5 X6 X7
VEE
Common Out/In X
Rev.2.00 Mar 30, 2006 page 2 of 10
HD74HC4051
Absolute Maximum Ratings
Item Supply voltage Control input voltage Switch I/O voltage Supply current Switch I/O current (per pin) Control input diode current Switch I/O diode current Power dissipation Storage temperature range (VCC) (GND) Symbol VCC VCC - VEE VIN VI/O ICC IGND II/O IIK IIOK PT Tstg Rating -0.5 to +7.0 -0.5 to +7.0 GND - 0.5 to VCC + 0.5 VEE - 0.5 to VCC + 0.5 +50 -50 25 20 20 500 -65 to +150 Unit V V V V mA mA mA mA mA mW C
Recommended Operating Conditions
Item Supply voltage Control input voltage Switch I/O voltage Operating temperature Input rise/fall time VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Symbol VCC - VEE GND - VEE VIN VI/O Topr tr , tf Min 2 -4 0 VEE -40 0 0 0 Typ -- -- -- -- -- -- -- -- Max 6 0 VCC VCC +85 1000 500 400 Unit V V V V C ns ns ns
Rev.2.00 Mar 30, 2006 page 3 of 10
HD74HC4051
Electrical Characteristics
Ta = 25C Item Control input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 VIL 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 ON resistance between any two channels OFF channel leakage current (switch off) OFF channel leakage current (switch on) Control input current Quiescent supply current RON 6.0 2.0 4.5 6.0 IS (OFF) 6.0 Min 1.5 3.15 4.2 -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- 2000 120 100 200 80 70 50 13 10 -- Max -- -- -- 0.5 1.35 1.8 5000 180 170 800 150 140 -- 40 20 0.1 Ta = -40 to+85C Min 1.5 3.15 4.2 -- -- -- -- -- -- -- -- -- -- -- -- -- Max -- -- -- 0.5 1.35 1.8 6250 225 210 1000 190 175 -- 50 25 1.0 A V Unit V Test Conditions
ON resistance
RON
VINH = VIL VI/O = VCC to VEE II/O 2 mA VINH = VIL VI/O = VCC or VEE VI/O 2 mA VINH = VIL VI/O = VCC to VEE II/O 2 mA VINH = VIL
IS (ON)
6.0
--
--
0.1
--
1.0
A
VINH = VIL
Iin ICC
6.0 6.0
-- --
-- --
0.1 4.0
-- --
1.0 40
A A
Vin = VCC or GND Vin = VCC or GND
Rev.2.00 Mar 30, 2006 page 4 of 10
HD74HC4051
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns, VEE = GND)
Ta = 25C Item Propagation delay time Symbol VCC (V) tPLH 2.0 4.5 6.0 tPHL 2.0 4.5 6.0 2.0 4.5 6.0 tPHL 2.0 4.5 6.0 2.0 4.5 6.0 tZL 2.0 4.5 6.0 2.0 4.5 6.0 tLZ 2.0 4.5 6.0 -- 5.0 5.0 5.0 5.0 4.5 4.5 Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ 25 6 5 25 6 5 50 16 14 50 16 14 50 14 12 50 14 12 40 17 14 40 17 14 5 5 22 0.7 22.0 0.1 95 Max 60 12 10 60 12 10 153 30 26 153 30 26 153 30 26 153 30 26 153 30 26 153 30 26 10 -- -- -- -- -- -- Ta = -40 to +85C Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 75 15 13 75 15 13 191 38 33 191 38 33 191 38 33 191 38 33 191 38 33 191 38 33 10 -- -- -- -- -- -- ns ns ns ns Unit ns Test Conditions RL = 10 k Switch input to switch output
Propagation delay time
tPLH
ns
RL = 10 k Control input to switch output
Output enable time
tZH
ns
RL = 1 k
Output disable time
tHZ
ns
RL = 1 k
Control input capacitance Switch input capacitance Output capacitance (Common pin) Feed through capacitance Power dissipation capacitance Sine wave distortion Frequency response channel "ON" (Sine wave input) Feed through attenuation Cross talk between any two switches Maximum control frequency
Cin Cin Cout Cin-out CPD
pF pF pF pF pF fin = 1 kHz, Vin = 4 VP-P RL = 10 k, CL = 50 pF MHz fin = 1 MHz, 20 log10 VOS/VIS = -3 dB RL = 50 , CL = 10 pF dB mV RL = 600 , CL = 50 pF, fin = 1 MHz RL = 600 , CL = 15 pF, fin = 1 MHz %
4.5 2.0 4.5 6.0 2.0 4.5 6.0
-- -- -- -- -- -- --
-50 25 60 75 20 30 30
-- -- -- -- -- -- --
-- -- -- -- -- -- --
-- -- -- -- -- -- --
MHz RL = 1 k, CL = 15 pF Vout = 1/2 (VCC)
Rev.2.00 Mar 30, 2006 page 5 of 10
HD74HC4051
Test Circuit
Maximum Control Frequency
VCC VCC VC 0V VCC Vin * VCC VEE GND
VC
Vout RL = 1 k CL = 15 pF Vout Vcc/2
Cross talk (Control Input to Switch Output)
tr VCC VCC Vin Rin = 600 VCC/2 VEE GND Vout RL = 600 VCC/2 CL = 50 pF VSS 10% 10% tf
VC
VCC
90%
(f = 1 MHz) tr = tr = 6 ns
Feed through Attenuation
VCC Vin (Sine Wave) 0.1 F fin Vin VEE VCC (OFF) GND Vout RL = 600 VCC/2 (Vin = 0 dBm, f = 1 MHz) CL = 50 pF
Rin = 600 VCC/2
Sine Wave Distortion
VCC Vin (Sine Wave) fin Vin 10 F VEE VCC (ON) GND Vout RL = 10 k VCC/2 CL = 50pF (Vin = 4 Vp-p, f = 1 kHz)
Rev.2.00 Mar 30, 2006 page 6 of 10
HD74HC4051 Cin, Cout, Cin-out (Input, Output, and Feed through Capacitance)
Cin-out
5V
VCC Signal Input Pin VEE Cin (OFF) GND Cout Commom Pin
Frequency Response Channel ON
VCC fin (Sine Wave) fin Vin 0.1 F VEE VCC (ON) GND Vout RL = 50 CL = 10 pF (Vout = 0 dBm, f = 1 MHz)
RON: ON Resistance
VCC
Vin
I/O VEE
VCC (ON) GND
O/I
Vout
V
VI-O
IS (OFF): OFF Channel Leakage Current (Switch OFF)
VCC
Vin = VCC or GND
I/O A VEE
VCC (OFF) GND
Vout = VSS or VCC
Rev.2.00 Mar 30, 2006 page 7 of 10
HD74HC4051 IS (ON): OFF Channel Leakage Current (Switch ON)
VCC
Vin = VCC or GND
I/O A VEE
VCC (ON) GND
Vout OPEN
tPLH, tPHL: Propagation Delay Time (Switch Input to Switch Output)
tr VCC VCC VCC (ON) VEE GND RL = 10 k CL = 50 pF Vout VOL Vin Vout GND VOH 50% 50% 10% 50% tPLH 90% 50% 10% tPHL tf
Vin
tPLH, tPHL: Propagation Delay Time (Control Input to Switch Output)
VC = Vin VCC or GND Switch input pin GND or VCC VEE VCC VCC VC VCC Vout (Common Pin) GND RL = 10 k CL = 50 pF Vout VOL GND tPLH VOH 50% 50% tPHL 50% 50%
tZH, tZL/tHZ, tLZ: Output Enable and Disable Time
tf tr
VCC VINH = Vin VCC VINH VCC Vout VEE VCC GND GND VCC GND RL = 1 k CL = 50 pF Vout VOL VOH Vout VOL VOH GND
90% 50% 10% tZH 10% tHZ
90% 50%
90% 50%
tZL 50%
tLZ
10%
Rev.2.00 Mar 30, 2006 page 8 of 10
HD74HC4051
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
A1
A
E
Reference Symbol
Dimension in Millimeters
Min
e
bp
e1
c
( Ni/Pd/Au plating )
e1 D E A A1 bp b3 c e Z L
Nom Max 7.62 19.2 20.32 6.3 7.4 5.06
L
0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0 15 2.29 2.54 2.79 1.12 2.54
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
8 bp x M L1
Reference Symbol
c
Dimension in Millimeters
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0 8 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15
Rev.2.00 Mar 30, 2006 page 9 of 10
A
HD74HC4051
JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A Previous Code FP-16DNV MASS[Typ.] 0.15g
*1
D 9
F
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
E HE
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
c
8 bp x M L1
Reference Symbol
Dimension in Millimeters
A1
L
y
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 9.90 10.30 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0 8 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08
Rev.2.00 Mar 30, 2006 page 10 of 10
A
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0

▲Up To Search▲

Price & Availability of HD74HC4051FPEL

	To Download HD74HC4051FPEL Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .